XINGSHEN | Treet the NEW YEAR | SHANGHAI XINGSHEN INSTRUMENT CO.,LTD.

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XINGSHEN | Treet the NEW YEAR

Release time：2023/01/16

Views：1,843

Next：Wang Yingrong, Secretary of the Party Committee and Chairman of the National Nuclear Demonstration Power Plant, and his party visited Shanghai Xingshen Instrument for investigation Previous：Congratulations to Shanghai Xingshen Instrument for obtaining the design and manufacturing license of civil nuclear safety equipment

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State Power Investment Group Energy Science and Technology Research Institute and Shanghai Xingshen Cooperation and Exchange and Signed a Framework Cooperation Agreement

on October 20, 2025, the Energy Science and Technology Research Institute of the State Power Investment Group (Shanghai Power Generation Equipment Design and Research Institute Co., Ltd., hereinafter referred to as" energy Research Institute (Shanghai Complete Set Institute)") and Shanghai Xingshen Instrument Co., Ltd. (hereinafter referred to as" shanghai Xingshen") in the Materials Technology Center of Energy Research Institute (Shanghai Complete Sets Institute) successful completion of cooperation and exchange and framework cooperation agreement signing ceremony. With technology as the link and synergy as the goal, the two sides focused on the core needs of the nuclear power field and officially opened a new chapter of in-depth cooperation.

Tarik Guessib, vice president of Schneider Electric Field Equipment Division, and his party of 6 people visited Shanghai Xingshen Instrument for inspection and exchange.

on October 21, 2025, Tarik Guessib, vice president of field equipment division of Schneider Electric (Schneider Electric), Senior Director of Sales Mark Avery, and a group of 6 people visited Shanghai Xingshen Instrument Co., LTD.

Dr. Thomas Ortlepp, President of the German National CIS Microsystem Sensor Research Institute, and his party visited Shanghai Xingshen Instrument Co., Ltd.

on September 30, 2025, Dr. Thomas Ortlepp, president of the German National CIS Microsystem Sensor Development Institute, and Lorenz Chen, a technical expert, visited Shanghai Xingshen Instrument Co., Ltd. (hereinafter referred to as "Xingshen Instrument") to carry out in-depth cooperation on 3D-MEMS technology radiation-resistant pressure sensor chip technology. This cooperation injects new kinetic energy into the collaborative innovation of radiation-resistant pressure sensor chip technology and provides new ideas for key technological breakthroughs in the field.

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