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SHANGHAI XINGSHEN INSTRUMENT CO.,LTD.

International cooperation and exchanges: The dean of the German National Microsystem Sensor Research Institute and his party visited Xingshen

Release time:2019/10/29

Views:638

On October 27, 2019, Thomas Ortlepp, dean of the German National Institute of Microsystem Sensors, and Lorenz CHEN, a technical expert, visited Xingshen to exchange and guide the MEMS smart sensors that the company is developing, and deepen cooperation. The current stage of the company’s MEMS The research and development achievements of the sensor were affirmed. Visit the MEMS sensor precision processing area

Visit the flow meter inspection and calibration laboratory

MEMS sensors are generally made of silicon-based materials and semiconductor integrated circuit manufacturing processes, and are highly integrated sensor systems with micromechanical and microelectronic functions. They are mostly used in military fields and occasions with high requirements for anti-interference environments.

At present, China’s MEMS industry is still in its infancy, and the main suppliers competing in the Chinese market are still dominated by multinational companies. In particular, almost 100% of mid-to-high-end sensor products are imported from abroad, and 90% of chips rely on foreign countries. Visit the buoy assembly and commissioning workshop

Product showroom group photo

China urgently needs to develop self-designed, manufactured and packaged MEMS sensors with independent intellectual property rights. We will cooperate and communicate with the world’s top sensor chip experts to contribute to the rise of China’s MEMS sensor industry!

State Power Investment Group Energy Science and Technology Research Institute and Shanghai Xingshen Cooperation and Exchange and Signed a Framework Cooperation Agreement

on October 20, 2025, the Energy Science and Technology Research Institute of the State Power Investment Group (Shanghai Power Generation Equipment Design and Research Institute Co., Ltd., hereinafter referred to as" energy Research Institute (Shanghai Complete Set Institute)") and Shanghai Xingshen Instrument Co., Ltd. (hereinafter referred to as" shanghai Xingshen") in the Materials Technology Center of Energy Research Institute (Shanghai Complete Sets Institute) successful completion of cooperation and exchange and framework cooperation agreement signing ceremony. With technology as the link and synergy as the goal, the two sides focused on the core needs of the nuclear power field and officially opened a new chapter of in-depth cooperation.

10-23

2025

Tarik Guessib, vice president of Schneider Electric Field Equipment Division, and his party of 6 people visited Shanghai Xingshen Instrument for inspection and exchange.

on October 21, 2025, Tarik Guessib, vice president of field equipment division of Schneider Electric (Schneider Electric), Senior Director of Sales Mark Avery, and a group of 6 people visited Shanghai Xingshen Instrument Co., LTD.

10-23

2025

Dr. Thomas Ortlepp, President of the German National CIS Microsystem Sensor Research Institute, and his party visited Shanghai Xingshen Instrument Co., Ltd.

on September 30, 2025, Dr. Thomas Ortlepp, president of the German National CIS Microsystem Sensor Development Institute, and Lorenz Chen, a technical expert, visited Shanghai Xingshen Instrument Co., Ltd. (hereinafter referred to as "Xingshen Instrument") to carry out in-depth cooperation on 3D-MEMS technology radiation-resistant pressure sensor chip technology. This cooperation injects new kinetic energy into the collaborative innovation of radiation-resistant pressure sensor chip technology and provides new ideas for key technological breakthroughs in the field.

10-16

2025

XINGSHENCONTACT XINGSHEN

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ADDRESS:NO.8,Xuanzhong Road,Xuanqiao Town, PuDong New Area, Shanghai, China 201399

TEL:+86-021-58308800

FAX:+86-021-58309955

E-mail:foxc@xingshen.com

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