on September 30, 2025, Dr. Thomas Ortlepp, president of the German National CIS Microsystem Sensor Development Institute, and Lorenz Chen, a technical expert, visited Shanghai Xingshen Instrument Co., Ltd. (hereinafter referred to as “Xingshen Instrument”) to carry out in-depth cooperation on 3D-MEMS technology radiation-resistant pressure sensor chip technology. This cooperation injects new kinetic energy into the collaborative innovation of radiation-resistant pressure sensor chip technology and provides new ideas for key technological breakthroughs in the field.

Dr. Thomas Ortlepp, president of German national CIS microsystem Sensor Development and Research Institute, and technical expert Lorenz Chen visited Shanghai Xingshen Instrument Co., Ltd.

Dr. Thomas Ortlepp is an old friend of Chen Yao, Chairman of Shanghai Xingshen instrument, who has visited the company for academic exchanges many times in recent years. During this exchange, the two sides will focus on the latest international 3D-MEMS technology radiation-resistant pressure sensor chips, especially for the core technical difficulties in the field of sensor chips in high radiation environments. Combining with Germany’s deep technical accumulation in the field of CIS microsystem miniaturization and long-term accumulation in the research field of high energy physics, Dr. Thomas Ortlepp shared the cutting-edge theoretical achievements and the latest experimental data of radiation-resistant sensor chip technology to the Xingshen instrument team. As the current international top technology direction in this field, its proposed anti-interference solution provides a key idea for improving the stability and accuracy of the sensor in a complex radiation field, and lays an important foundation for the subsequent technology integration of both parties.

Dr Thomas Ortlepp, director of the CIS microsystem Sensor Development Institute, Germany

On September 25, 2025, Dr. Thomas Ortlepp, President of the German National CIS Microsystem Sensor Development Research Institute, delivered a keynote speech on 3D-MEMS technology radiation-resistant pressure sensor chips as a guest speaker at the Shanghai International Procurement Exhibition Center and the China (Shanghai) International Sensor Technology and Application Exhibition-“Pressure Sensor Innovation Industry Forum.